INTEGRATED PASSIVE DEVICES FABRICATED UTILIZING MULTI-LAYER, ORGANIC LAMINATES

The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be con...

Full description

Saved in:
Bibliographic Details
Main Authors SUNDARAM, VENKATESH, SWAMINATHAN, MADHAVAN, DALMIA, SIDHARTH, WHITE, GEORGE, E
Format Patent
LanguageEnglish
French
German
Published 24.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
INDUCTANCES
MAGNETS
RESONATORS
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
WAVEGUIDES
Online AccessGet full text

Cover

More Information
Summary:The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
Bibliography:Application Number: EP20040759006