STRESS-FREE COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING SUCH A COMPOSITE SUBSTRATE

A stress free composite substrate is disclosed comprising a carrier ( 2 ) composed of a carrier material, a first layer ( 12 ) composed of a first material, and an intermediate layer composed of a second material being located between the carrier ( 2 ) and the first layer ( 12 ), wherein the first m...

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Bibliographic Details
Main Author HAISMA, JAN
Format Patent
LanguageEnglish
French
German
Published 21.09.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A stress free composite substrate is disclosed comprising a carrier ( 2 ) composed of a carrier material, a first layer ( 12 ) composed of a first material, and an intermediate layer composed of a second material being located between the carrier ( 2 ) and the first layer ( 12 ), wherein the first material has a dilatation behavior being substantially the same as that of the carrier material, and having a dilatation mismatch with the second material, the intermediate layer ( 6 ) having structures ( 8 ) of second material for absorbing stress originating from the dilatation mismatch. A method for making such a stress free composite substrate is also disclosed.
Bibliography:Application Number: EP20030772538