ENCAPSULATED MICROSTRUCTURE AND METHOD OF PRODUCING ONE SUCH MICROSTRUCTURE

The microstructure has a substrate (6) with a sensitive element (1) connected to a contact pad (3). The sensitive element, electrical connection and contact pad form an assembly with a limiting channel (11) and covering cap (5). There is an opening (12) above the contact pad and a zone (9) by the si...

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Bibliographic Details
Main Authors DELAPIERRE, Gilles, DIEM, Bernard
Format Patent
LanguageEnglish
French
German
Published 10.01.2018
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:The microstructure has a substrate (6) with a sensitive element (1) connected to a contact pad (3). The sensitive element, electrical connection and contact pad form an assembly with a limiting channel (11) and covering cap (5). There is an opening (12) above the contact pad and a zone (9) by the side of the channel.
Bibliography:Application Number: EP20030810000