Method of analyzing electronic components, device for analyzing electronic components and electronic components using these

A method of analyzing electronic components and the analyzing device, with which the designing time can be made shorter and the cost reduction can be implemented. In analyzing an electronic component comprising bump electrode, such as a solder bump, an Au bump or BGA, a 3-D model electronic data con...

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Bibliographic Details
Main Author SASAKI, YUKINORI
Format Patent
LanguageEnglish
French
German
Published 15.06.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A method of analyzing electronic components and the analyzing device, with which the designing time can be made shorter and the cost reduction can be implemented. In analyzing an electronic component comprising bump electrode, such as a solder bump, an Au bump or BGA, a 3-D model electronic data containing information on the shape of electronic component is provided at step S1. Next at step S2, curved line and curved surface forming the 3-D model is replaced with a 3-D model approximated using polygons. At step S3, a finite element model is provided by converting the polygon-approximated 3-D model. And then at step S4, numerical simulation such as a finite element analysis which uses the finite element model made available at the step 3 is executed. Finally at step S5, the analysis results are displayed for evaluation.
Bibliography:Application Number: EP20040028218