METHOD FOR CHEMICAL MECHANICAL POLISHING (CMP) OF LOW-K DIELECTRIC MATERIALS
The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a li...
Saved in:
| Main Authors | , , , |
|---|---|
| Format | Patent |
| Language | English French German |
| Published |
01.06.2005
|
| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate. |
|---|---|
| AbstractList | The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate. |
| Author | MOEGGENBORG, K.J CHOU, H HAWKINS, J.D CHAMBERLAIN, J.P |
| Author_xml | – fullname: MOEGGENBORG, K.J – fullname: HAWKINS, J.D – fullname: CHOU, H – fullname: CHAMBERLAIN, J.P |
| BookMark | eNrjYmDJy89L5WTw8XUN8fB3UXDzD1Jw9nD19XR29FHwdXX2cPQDMwP8fTyDPTz93BU0nH0DNBX83RR8_MN1vRVcPF19XJ1DgjydFXwdQ1yDPB19gnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgKGpsYm5pamjkTERSgA2Mi65 |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | PROCEDE DE POLISSAGE CHIMIQUE-MECANIQUE (CMP) POUR MATERIAUX DIELECTRIQUES A FAIBLE CONSTANTE K VERFAHREN ZUM CHEMISCH MECHANISCH POLIEREN VON MATERIALIEN MIT EINER NIEDRIGEN DIELEKTRIZITÄTSKONSTANTEN |
| Edition | 7 |
| ExternalDocumentID | EP1534795A2 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_EP1534795A23 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:18:29 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English French German |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_EP1534795A23 |
| Notes | Application Number: EP20030740859 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050601&DB=EPODOC&CC=EP&NR=1534795A2 |
| ParticipantIDs | epo_espacenet_EP1534795A2 |
| PublicationCentury | 2000 |
| PublicationDate | 20050601 |
| PublicationDateYYYYMMDD | 2005-06-01 |
| PublicationDate_xml | – month: 06 year: 2005 text: 20050601 day: 01 |
| PublicationDecade | 2000 |
| PublicationYear | 2005 |
| RelatedCompanies | CABOT MICROELECTRONICS CORPORATION |
| RelatedCompanies_xml | – name: CABOT MICROELECTRONICS CORPORATION |
| Score | 2.6235192 |
| Snippet | The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
| Title | METHOD FOR CHEMICAL MECHANICAL POLISHING (CMP) OF LOW-K DIELECTRIC MATERIALS |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050601&DB=EPODOC&locale=&CC=EP&NR=1534795A2 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKepNp-L8IgcpeiiutmvpYUiXpnTaL2bV3UazprBLN1zFf9_X0E4venskEJIHv_eVl18Abrg2KEyhcRVD_0w1rAehZlpuqbmW13xgZlbkskE2Mv1X42k2nHVg2b6FkTyhX5IcERG1QLxX0l6vf4pYruyt3NzzJQ6tHr105CptdlzT5WmKOx6xJHZjqlCKkhJNa2Ablj100FrvYBRt1WBgb-P6Ucr6t0fxDmE3wcXK6gg6ouzBPm0_XuvBXtjcd6PYQG9zDEHIUj92CWZtpOUxICGjvhNJMYmb2hO5pWFyR2KPBPG7-kww4AsYTacTSkIHg9eJE7ycAPFYSn0VtzXfqmDOku0B9FPolqtSnAHRdY7ZxoJr6GEModtZMbBFhsrPzGJg6EUf-n8uc_7P3AUcSIZSWWy4hG718Smu0PdW_Fpq7RuhzoGD |
| link.rule.ids | 230,309,783,888,25576,76876 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKc6bTsX5mYMUPRTbtWvZYUiXprSuX8yqu412TWGXbriK_76vYZ1e9PZIICQPfu8rL78A3GWqUhhczWQM_VNZN_tcTtXclHM1r_nAjLTIRYNsaLiv-vNsMGvBsnkLI3hCvwQ5IiJqgXivhL1e_xSxbNFbuXnMlji0enKSkS012XFNl6dK9njE4siOqEQpSlI4rYGtm8OBhdZ6DyNsswYDexvXj1LWvz2KcwT7MS5WVsfQ4mUXOrT5eK0LB8H2vhvFLfQ2J-AHLHEjm2DWRhoeAxIw6lqhEONoW3si9zSIH0jkED96lycEAz6f0WTqURJYGLx6lv9yCsRhCXVl3NZ8p4I5i3cH0M6gXa5Kfg5E0zLMNhaZih5G59owLZQhT1H5qVEoulb0oPfnMhf_zN1Cx00Cf-574eQSDgVbqSg8XEG7-vjk1-iHq-xGaPAb4NiEdg |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=METHOD+FOR+CHEMICAL+MECHANICAL+POLISHING+%28CMP%29+OF+LOW-K+DIELECTRIC+MATERIALS&rft.inventor=MOEGGENBORG%2C+K.J&rft.inventor=HAWKINS%2C+J.D&rft.inventor=CHOU%2C+H&rft.inventor=CHAMBERLAIN%2C+J.P&rft.date=2005-06-01&rft.externalDBID=A2&rft.externalDocID=EP1534795A2 |