METHOD FOR CHEMICAL MECHANICAL POLISHING (CMP) OF LOW-K DIELECTRIC MATERIALS
The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a li...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
01.06.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate. |
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Bibliography: | Application Number: EP20030740859 |