FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME

A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes ("LEDs") and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric...

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Bibliographic Details
Main Authors STECHER, THOMAS, ELLIOT, BECKER, CHARLES, ADRIAN, WEAVER, STANTON, EARL
Format Patent
LanguageEnglish
French
German
Published 19.01.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes ("LEDs") and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.
Bibliography:Application Number: EP20030717949