Method of forming conductive line for semiconductor device using carbon nanotube and semiconductor device manufactured using the method
Provided are a method of forming a conductive line for a semiconductor device using a carbon nanotube and a semiconductor device manufactured using the method. The method includes: activating a surface of an electrode (120) of the semiconductor device using surface pretreatment; forming an insulatin...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
09.05.2012
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Subjects | |
Online Access | Get full text |
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Summary: | Provided are a method of forming a conductive line for a semiconductor device using a carbon nanotube and a semiconductor device manufactured using the method. The method includes: activating a surface of an electrode (120) of the semiconductor device using surface pretreatment; forming an insulating layer (130) on the electrode, and forming a contact hole (132) in the insulating layer in such a way that a part of the activated surface (122) of the electrode is exposed outside; and feeding a carbon-containing gas on the activated surface of the electrode via the contact hole to grow a carbon nanotube (140), which forms the conductive line, on the activated surface of the electrode. The activation step of the electrode surface can be replaced with formation step of a catalytic metal layer on the electrode surface. According to the method, the carbon nanotube with a high current density forms a conductive line for a semiconductor device, and thus, an ultra-highly integrated semiconductor device can be manufactured. |
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Bibliography: | Application Number: EP20040252117 |