Wafer-scale replication-technique for opto-mechanical structures on opto-electronic devices

In a partial UV-casting process carried out on a wafer scale the process of separating the wafer and the mold may significantly be improved by providing elevated temperatures and/or a reduced viscosity of the replication material during and/or immediately before the separation. Thus, even delicate r...

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Bibliographic Details
Main Authors MOSER, MICHAEL, GIMKIEWICZ, CHRISTIANE, GALE, MICHAEL T
Format Patent
LanguageEnglish
French
German
Published 22.09.2004
Edition7
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:In a partial UV-casting process carried out on a wafer scale the process of separating the wafer and the mold may significantly be improved by providing elevated temperatures and/or a reduced viscosity of the replication material during and/or immediately before the separation. Thus, even delicate replica features may be obtained. In a preferred embodiment, an organically modified ceramic material is used as the replication material.
Bibliography:Application Number: EP20030006488