METHOD FOR PHOTOLITHOGRAPHIC STRUCTURING BY MEANS OF A CARBON HARD MASK LAYER WHICH HAS A DIAMOND-LIKE HARDNESS AND IS PRODUCED BY MEANS OF A PLASMA-ENHANCED DEPOSITION METHOD

A carbon hard mask layer is applied to a substrate to be patterned by means of a plasma-enhanced deposition process in such a manner that it has a hardness comparable to that of diamond in at least one layer thickness section. During the production of this diamond-like layer thickness section, the p...

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Main Authors STEGEMANN, MAIK, WEGE, STEPHAN, VOGT, MIRKO, FUELBER, CARSTEN, KIRCHHOFF, MARKUS, CZECH, GUENTHER
Format Patent
LanguageEnglish
French
German
Published 24.01.2007
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Summary:A carbon hard mask layer is applied to a substrate to be patterned by means of a plasma-enhanced deposition process in such a manner that it has a hardness comparable to that of diamond in at least one layer thickness section. During the production of this diamond-like layer thickness section, the parameters used in the deposition are set in such a manner that growth regions which are produced in a form other than diamond-like are removed again in situ by means of subsequent etching processes and that diamond-like regions which are formed are retained.
Bibliography:Application Number: EP20020776865