Copper carbene complexes and the use thereof

New copper carbene complexes contain ligands comprising a 1,3-di(aralkyl) or -(hetero)aryl-imidazol(id)ine or corresponding bridged compound or oligomer. New copper (Cu) carbene complexes contain ligands comprising a 1,3-di(aralkyl) or -(hetero)aryl-imidazol(id)ine or corresponding bridged compound...

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Bibliographic Details
Main Authors SCHOLZ, ULRICH, GANZER, DIRK, KUNZ, KLAUS, WESENER, JOACHIM, GAERTZEN, OIIVER
Format Patent
LanguageEnglish
French
German
Published 28.06.2006
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Summary:New copper carbene complexes contain ligands comprising a 1,3-di(aralkyl) or -(hetero)aryl-imidazol(id)ine or corresponding bridged compound or oligomer. New copper (Cu) carbene complexes contain ligands comprising a 1,3-di(aralkyl) or -(hetero)aryl-imidazol(id)ine or corresponding bridged compound or oligomer of formula (I); G = an ethan-1,2-diyl or ethen-1,2-diyl group, which may be mono- or poly-substituted; B1 = 5-18 C aryl, 1-18 C alkyl, optionally containing O, N or S heteroatom(s), or 6-19 C aralkyl; B2 = an n-valent group with a total of 2-40 C; n = 1, 2 or 3. Independent claims are also included for: (1) catalysts containing the Cu complexes; (2) preparation of substituted aromatic compounds of formula (IV) by reacting compounds of formulae (V) and (VI) in the presence of base and catalysts containing the Cu complexes: Ar-(F-R2)n (IV); Ar-Z (V); H-F-R2 (VI); n = 1, 2 or 3; Ar = an (un)substituted aromatic group; F = O, S, NR3, NR3CO or ethyndiyl; R3 = H, 1-12 C alkyl, 5-18 C aryl or 6-19 C arylalkyl; R2 = Ar, 1-12 C (halo)alkyl, 1-12 C alkenyl or 6-19 C arylalkyl; Z = Cl, Br, I, a diazonium salt or a sulfonate
Bibliography:Application Number: EP20030029974