STACKING OF MULTILAYER MODULES

Each multilayer module (10) of a plurality of multilayer modules has a plurality of layers (20) wherein each layer has a substrate (22) therein. The plurality of multilayer modules (10) includes a first multilayer module (10) including a first layer (20) and a second multilayer (10) module including...

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Bibliographic Details
Main Authors YAMAGUCHI, JAMES, SATSUO, OZGUZ, VOLKAN, H, CAMIEN, ANDREW, NELSON, PEPE, ANGEL, ANTONIO
Format Patent
LanguageEnglish
French
German
Published 02.12.2009
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Each multilayer module (10) of a plurality of multilayer modules has a plurality of layers (20) wherein each layer has a substrate (22) therein. The plurality of multilayer modules (10) includes a first multilayer module (10) including a first layer (20) and a second multilayer (10) module including a second layer (20) each having a top side and bottom side. The first layer (20) and second layer (20) each includes a substrate (22), at least one electronic element (26), and a plurality of electrically-conductive traces (28). The plurality of multilayer modules (10) further includes a heat-separating layer (40) disposed between the top side of the first layer (20) and the bottom side of the second layer (20). The first multilayer module (10) is adhered to the second multilayer module (10) and the first multilayer module (10) can be detached from the second multilayer module (10) by applying heat to the heat-separating layer (40).
Bibliography:Application Number: EP20020798173