Thermally developable materials containing backside conductive layer

Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixt...

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Main Authors LABELLE, GARY E, BHAVE, APARNA V, PHAM, OANH V, SAKIZADEH, KUMARS, LUDEMANN, THOMAS J
Format Patent
LanguageEnglish
French
German
Published 26.04.2006
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Summary:Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixture of two or more polymers that includes a first polymer serving to promote adhesion of the backside conductive layer directly to the support or other layers, and a second polymer that is different than and forms a single phase mixture with the first polymer.
Bibliography:Application Number: EP20030078608