Thermally developable materials containing backside conductive layer
Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixt...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
26.04.2006
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Subjects | |
Online Access | Get full text |
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Summary: | Thermally developable materials that comprise a support have at least two backside layers. One of these layers can be a protective layer comprising a film-forming polymer. The materials also includes a non-imaging backside conductive layer comprising non-acicular metal antimonate particles in a mixture of two or more polymers that includes a first polymer serving to promote adhesion of the backside conductive layer directly to the support or other layers, and a second polymer that is different than and forms a single phase mixture with the first polymer. |
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Bibliography: | Application Number: EP20030078608 |