Microstructure cooling device and use thereof

The microstructure cooler has a stack of at least two metal films (1) and a base plate (5) for contacting the object (4) to be cooled via a thermal contact surface (6). The base plate and metal foils are connected by material locking and coolant channels (2) are provided in the metal films with brea...

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Bibliographic Details
Main Authors THEISEN, SVEN, HERBER, RALPH, CRAEMER, KONRAD, PRECHTL, PETER, MEYER, HEINRICH, KURTZ, OLAF, HOEHN, MARKUS
Format Patent
LanguageEnglish
French
German
Published 06.05.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COLD ROOMS
COMBINED HEATING AND REFRIGERATION SYSTEMS
COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT PUMP SYSTEMS
HEATING
ICE-BOXES
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
PRINTED CIRCUITS
REFRIGERATION OR COOLING
REFRIGERATORS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:The microstructure cooler has a stack of at least two metal films (1) and a base plate (5) for contacting the object (4) to be cooled via a thermal contact surface (6). The base plate and metal foils are connected by material locking and coolant channels (2) are provided in the metal films with breadths from 100 to 2000 microns, depths from 25 to 1000 microns and mean separation from 50 to 1000 microns.
Bibliography:Application Number: EP20030090048