Method for making an electric circuit including a polishing step
Fabrication of integrated circuit comprises formation and withdrawal of conducting inserts. Some components (10, 20) of electric circuit are incorporated in some insulating materials (2, 4) superposed above substrate (1). Exclusion volume is arranged around certain components (10) sensitive to elect...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
27.01.2010
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Subjects | |
Online Access | Get full text |
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Summary: | Fabrication of integrated circuit comprises formation and withdrawal of conducting inserts. Some components (10, 20) of electric circuit are incorporated in some insulating materials (2, 4) superposed above substrate (1). Exclusion volume is arranged around certain components (10) sensitive to electrostatic coupling whilst conferring flat surface (S2) to each material (2, 4) at end of polishing. |
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Bibliography: | Application Number: EP20030292029 |