Semiconductor module and power conversion device
One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated stru...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
14.06.2006
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Subjects | |
Online Access | Get full text |
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Summary: | One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13. |
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Bibliography: | Application Number: EP20030014502 |