Semiconductor module and power conversion device

One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated stru...

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Bibliographic Details
Main Authors ANAN, HIROMICHI, OCHIAI, YOSHITAKA, YOSHIZAKI, ATSUHIRO, MASHINO, KEIICHI
Format Patent
LanguageEnglish
French
German
Published 14.06.2006
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Summary:One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
Bibliography:Application Number: EP20030014502