POWER MODULE HAVING IMPROVED TRANSIENT THERMAL IMPEDANCE

An electronic power module includes at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance. The electronic power devices are connected by a sintered layer on their underside to an upper copper layer of the DCB ceramic substrate. The...

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Bibliographic Details
Main Authors THOBEN, MARKUS, TADROS, YEHIA, PALM, GERHARD
Format Patent
LanguageEnglish
French
German
Published 01.05.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic power module includes at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance. The electronic power devices are connected by a sintered layer on their underside to an upper copper layer of the DCB ceramic substrate. The upper copper layer of the DCB ceramic substrate is structured into copper conductor tracks for electrically contacting the power devices. The lower copper layer of the DCB ceramic substrate is connected by a sintered layer to a heat sink. The upper sides of the power devices are connected by a sintered layer to an addition thermal capacitance.
Bibliography:Application Number: EP20010985836