METHOD FOR UTILISING A WASTE SLURRY FROM SILICON WAFER PRODUCTION

This invention relates to method of utilising a waste slurry from silicon wafer production. More specific, this invention relates to a method for utilising the solid fraction of the slurry, which stems from the sawing or slicing of silicon wafers as a raw material in other industrial processes such...

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Bibliographic Details
Main Author HENRIKSEN, KNUT
Format Patent
LanguageEnglish
French
German
Published 15.09.2004
Edition7
Subjects
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Summary:This invention relates to method of utilising a waste slurry from silicon wafer production. More specific, this invention relates to a method for utilising the solid fraction of the slurry, which stems from the sawing or slicing of silicon wafers as a raw material in other industrial processes such as production of certain ceramics, such as silicon nitride bonded silicon carbide and/or silicon bonded silicon carbide.
Bibliography:Application Number: EP20010983873