METHOD FOR UTILISING A WASTE SLURRY FROM SILICON WAFER PRODUCTION
This invention relates to method of utilising a waste slurry from silicon wafer production. More specific, this invention relates to a method for utilising the solid fraction of the slurry, which stems from the sawing or slicing of silicon wafers as a raw material in other industrial processes such...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
15.09.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | This invention relates to method of utilising a waste slurry from silicon wafer production. More specific, this invention relates to a method for utilising the solid fraction of the slurry, which stems from the sawing or slicing of silicon wafers as a raw material in other industrial processes such as production of certain ceramics, such as silicon nitride bonded silicon carbide and/or silicon bonded silicon carbide. |
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Bibliography: | Application Number: EP20010983873 |