METHOD FOR PRODUCING GROUP III METAL NITRIDE BASED MATERIALS

A high deposition rate sputter method is utilized to produce bulk, single-crystal, low-defect density Group III nitride materials suitable for microelectronic and optoelectronic devices and as substrates for subsequent epitaxy, and to produce highly oriented polycrystalline windows. A template mater...

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Main Authors WILLIAMS, N., MARK, HANSER, ANDREW, D, CARLSON, ERIC, P, CUOMO, JEROME, J, THOMAS, DARIN, T
Format Patent
LanguageEnglish
French
German
Published 12.10.2011
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Summary:A high deposition rate sputter method is utilized to produce bulk, single-crystal, low-defect density Group III nitride materials suitable for microelectronic and optoelectronic devices and as substrates for subsequent epitaxy, and to produce highly oriented polycrystalline windows. A template material having an epitaxial-initiating growth surface is provided. A Group III metal target is sputtered in a plasma-enhanced environment using a sputtering apparatus comprising a non-thermionic electron/plasma injector assembly, thereby to producing a Group III metal source vapor. The Group III metal source vapor is combined with a nitrogen-containing gas to produce a reactant vapor species comprising Group III metal and nitrogen. The reactant vapor species is deposited on the growth surface to produce a single-crystal MN layer thereon. The template material is removed, thereby providing a free-standing, single-crystal MN article having a diameter of approximately 0.5 inch or greater and a thickness of approximately 50 microns or greater.
Bibliography:Application Number: EP20010998673