METHOD FOR PRODUCING GROUP III METAL NITRIDE BASED MATERIALS
A high deposition rate sputter method is utilized to produce bulk, single-crystal, low-defect density Group III nitride materials suitable for microelectronic and optoelectronic devices and as substrates for subsequent epitaxy, and to produce highly oriented polycrystalline windows. A template mater...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
12.10.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A high deposition rate sputter method is utilized to produce bulk, single-crystal, low-defect density Group III nitride materials suitable for microelectronic and optoelectronic devices and as substrates for subsequent epitaxy, and to produce highly oriented polycrystalline windows. A template material having an epitaxial-initiating growth surface is provided. A Group III metal target is sputtered in a plasma-enhanced environment using a sputtering apparatus comprising a non-thermionic electron/plasma injector assembly, thereby to producing a Group III metal source vapor. The Group III metal source vapor is combined with a nitrogen-containing gas to produce a reactant vapor species comprising Group III metal and nitrogen. The reactant vapor species is deposited on the growth surface to produce a single-crystal MN layer thereon. The template material is removed, thereby providing a free-standing, single-crystal MN article having a diameter of approximately 0.5 inch or greater and a thickness of approximately 50 microns or greater. |
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Bibliography: | Application Number: EP20010998673 |