Heat dissipator for integrated circuits

Heat dissipator for integrated circuits (2) comprising a dispersion element (3) able to be associated to an integrated circuit (2), through securing means (4) constituted by two locking elements (9) mounted on the dispersion element (3) in mutually opposite positions. The locking elements (9) have e...

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Bibliographic Details
Main Author SEGALA, MARCO
Format Patent
LanguageEnglish
French
German
Published 03.09.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Heat dissipator for integrated circuits (2) comprising a dispersion element (3) able to be associated to an integrated circuit (2), through securing means (4) constituted by two locking elements (9) mounted on the dispersion element (3) in mutually opposite positions. The locking elements (9) have each a latching pin (11) and are able to slide laterally to the dispersion element (3) from a lower position in which the pins (11) are inferiorly distanced from the base (5) and form between them a passage (12) for the coupling of the dissipator (1) on an integrated circuit (2), to an upper position in which the pins (11) are proximate to the base (5) and are mutually approached. The dissipator (1) further comprises elastic means (13) interposed between the dispersion element (3) and the locking elements (9) to thrust them towards the upper position.
Bibliography:Application Number: EP20020425108