ABRASIVE ARTICLE HAVING A WINDOW SYSTEM FOR POLISHING WAFERS, AND METHODS

A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating...

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Bibliographic Details
Main Authors PENDERGRASS, DANIEL, B, KIM, CHONG, YONG, FIZEL, JERRY, J, GAGLIARDI, JOHN, J, BRUXVOORT, WESLEY, J, STREIFEL, ROBERT, J, MUILENBURG, MICHAEL, J, WEBB, RICHARD, J
Format Patent
LanguageEnglish
French
German
Published 27.08.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.
Bibliography:Application Number: EP20010926874