Method for making a thin layer composite unimorph ferroelectric driver and sensor

A method for forming ferroelectric wafers (10) is provided. A prestress layer (14) is placed on the desired mold. A ferroelectric wafer (12) is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may...

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Bibliographic Details
Main Authors FOX, ROBERT L, JALINK, ANTONY JR, BRYANT, ROBERT G, SIMPSON, JOYCELYN O, W RORHBACH, WAYNE, HELLBAUM, RICHARD F
Format Patent
LanguageEnglish
French
German
Published 30.05.2007
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PERFORMING OPERATIONS
PHYSICS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TESTING
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A method for forming ferroelectric wafers (10) is provided. A prestress layer (14) is placed on the desired mold. A ferroelectric wafer (12) is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
Bibliography:Application Number: EP20030001185