Use of a surface for heat transfer, more especially for fluid evaporation and condensation process
The heat transfer surface (3), on a plate or tube body (4), has a galvanized projecting micro-structure extending from the base surface (3a) with a minimum height of 10 mu m. The base surface is covered with projections (6), wholly or partially, as pin-shaped micro-structures. The longitudinal axes...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
16.01.2008
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Subjects | |
Online Access | Get full text |
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Summary: | The heat transfer surface (3), on a plate or tube body (4), has a galvanized projecting micro-structure extending from the base surface (3a) with a minimum height of 10 mu m. The base surface is covered with projections (6), wholly or partially, as pin-shaped micro-structures. The longitudinal axes (6c) of the micro-pins are either at right angles to the surface or they are pitched at an angle of 30-90 degrees to the surface. The micro-pins have a thickness (d) of 0.2-100.0 mu m, with a pin density of 10 -10 per cm . The structures are galvanized on to the surface using a polymer membrane with micro-pores. |
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Bibliography: | Application Number: EP20020027031 |