PHOTORESIST COMPOSITION FOR DEEP UV AND PROCESS THEREOF
The present invention relates to a chemically amplified system, which is, sensitive to wavelengths between 300 nm and 100 nm, and comprises a) a polymer that is insoluble an aqueous alkaline solution and comprises at least one acid labile group, b) a compound capable of producing an acid upon radiat...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
20.06.2007
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a chemically amplified system, which is, sensitive to wavelengths between 300 nm and 100 nm, and comprises a) a polymer that is insoluble an aqueous alkaline solution and comprises at least one acid labile group, b) a compound capable of producing an acid upon radiation. The present invention comprises a polymer that is made from a alicyclic hydrocarbon olefin, an acrylate with a pendant cyclic moeity, and a cyclic anhydride. The present invention also relates to a process for imaging such a photoresist. |
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Bibliography: | Application Number: EP20010967154 |