Electroless gold plating composition
Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing ele...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
21.11.2018
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided. |
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Bibliography: | Application Number: EP20020257270 |