Electronic circuit unit suitable for miniaturization
The electronic circuit unit of the present invention includes first and second insulating substrates (1,6) on respective surfaces of which wiring patterns are formed, and thick-film passive elements (3/8) formed on the surfaces of the first and second insulating substrates in a state in which they a...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
16.04.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The electronic circuit unit of the present invention includes first and second insulating substrates (1,6) on respective surfaces of which wiring patterns are formed, and thick-film passive elements (3/8) formed on the surfaces of the first and second insulating substrates in a state in which they are connected to the wiring patterns, wherein the first and second insulating substrates are disposed vertically opposite to each other, and the wiring patterns provided on the first and second insulating substrates are connected through metallic bumps (11) provided between the first and second insulating substrates. With this construction, since the first and second insulating substrates can be disposed vertically, a small-sized electronic circuit unit can be provided which is smaller in a width direction than conventional ones. |
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Bibliography: | Application Number: EP20020257017 |