Electronic circuit unit suitable for miniaturization

The electronic circuit unit of the present invention includes first and second insulating substrates (1,6) on respective surfaces of which wiring patterns are formed, and thick-film passive elements (3/8) formed on the surfaces of the first and second insulating substrates in a state in which they a...

Full description

Saved in:
Bibliographic Details
Main Author HIROSE, YOSHITAKA
Format Patent
LanguageEnglish
French
German
Published 16.04.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The electronic circuit unit of the present invention includes first and second insulating substrates (1,6) on respective surfaces of which wiring patterns are formed, and thick-film passive elements (3/8) formed on the surfaces of the first and second insulating substrates in a state in which they are connected to the wiring patterns, wherein the first and second insulating substrates are disposed vertically opposite to each other, and the wiring patterns provided on the first and second insulating substrates are connected through metallic bumps (11) provided between the first and second insulating substrates. With this construction, since the first and second insulating substrates can be disposed vertically, a small-sized electronic circuit unit can be provided which is smaller in a width direction than conventional ones.
Bibliography:Application Number: EP20020257017