Sealing structure for highly moisture sensitive electronic device element and method for fabrication
A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclos...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
04.10.2006
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices. |
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AbstractList | A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices. |
Author | BOROSON, MICHAEL LOUIS SERBICKI, JEFFREY PETER BESSEY, PETER G SCHMITTENDORF, JOHN |
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DocumentTitleAlternate | Structure d'étanchéité pour un dispositif électronique hautement sensible à l'humidité et méthode de fabrication Dichtungsstruktur für sehr feuchtigkeitsempfindliche elektronische Vorrichtung und Herstellungsverfahren |
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Snippet | A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SEPARATION TRANSPORTING |
Title | Sealing structure for highly moisture sensitive electronic device element and method for fabrication |
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