Sealing structure for highly moisture sensitive electronic device element and method for fabrication

A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclos...

Full description

Saved in:
Bibliographic Details
Main Authors SERBICKI, JEFFREY PETER, BOROSON, MICHAEL LOUIS, SCHMITTENDORF, JOHN, BESSEY, PETER G
Format Patent
LanguageEnglish
French
German
Published 04.10.2006
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
AbstractList A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
Author BOROSON, MICHAEL LOUIS
SERBICKI, JEFFREY PETER
BESSEY, PETER G
SCHMITTENDORF, JOHN
Author_xml – fullname: SERBICKI, JEFFREY PETER
– fullname: BOROSON, MICHAEL LOUIS
– fullname: SCHMITTENDORF, JOHN
– fullname: BESSEY, PETER G
BookMark eNqNjM0KwjAQBnPQg3_vsC_gQQtSjyIVj4LeS0y-tgvppiTbgm8vFB_A08AwzNosJApWxj9hA0tLWdPodEygJibquO3Ch_rIeXYZkll5AiHAaYrCjjwmdrPpIUpWPPXQLvp50dh3YmeVo2zNsrEhY_fjxtCtel3vewyxRh6sg0Dr6nE4nk9FWV6K4o_kCy9nQRA
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate Structure d'étanchéité pour un dispositif électronique hautement sensible à l'humidité et méthode de fabrication
Dichtungsstruktur für sehr feuchtigkeitsempfindliche elektronische Vorrichtung und Herstellungsverfahren
Edition 7
ExternalDocumentID EP1296388A3
GroupedDBID EVB
ID FETCH-epo_espacenet_EP1296388A33
IEDL.DBID EVB
IngestDate Fri Aug 02 08:53:16 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
French
German
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_EP1296388A33
Notes Application Number: EP20020078714
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061004&DB=EPODOC&CC=EP&NR=1296388A3
ParticipantIDs epo_espacenet_EP1296388A3
PublicationCentury 2000
PublicationDate 20061004
PublicationDateYYYYMMDD 2006-10-04
PublicationDate_xml – month: 10
  year: 2006
  text: 20061004
  day: 04
PublicationDecade 2000
PublicationYear 2006
RelatedCompanies EASTMAN KODAK COMPANY
RelatedCompanies_xml – name: EASTMAN KODAK COMPANY
Score 2.6605046
Snippet A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
SEPARATION
TRANSPORTING
Title Sealing structure for highly moisture sensitive electronic device element and method for fabrication
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061004&DB=EPODOC&locale=&CC=EP&NR=1296388A3
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5qFfWmVbG-2IPkFmxMmqaHIDYPitA2aJXeym6ygYImpYmI_96ZbZp60dsyIUNmybx3vwG4NXup2eO2oRs8xQQlFvc6zRXRDdEx0jjBxFl1dEdje_hqPc26swYsNndhFE7olwJHRI2KUd9LZa-X2yKWr85WFndigaT8IZy6vlZnxwSApvkDN4gm_sTTPA9X2vjZRbeGf5rzaO7ALkXRBLMfvA3oUsryt0cJj2AvQmZZeQwNmbXgwNsMXmvB_qjqd-OyUr3iBJIXDOnQz7A14uvnSjKMNxnBDb9_s48cXyZaQQfSyYSx7YAblkiyB0ShWiDjWcLWk6MVi5SLVSX0KbAwmHpDHT93Xm_NPIhqwcwzaGZ5Js-B2ZjyWkkqHZPQ8nmKUVY36duCW7HRd2SnDe0_2Vz88-wSDlUFgvrn1hU0UV55jT65FDdqN38A_SKTBA
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7Uaqw3rRrrcw-GG7EIBXogxvIIaqFE0fTW8FiSJgpNwRj_vbNbSr3obTOECbNh3rvfAFzLWiZrkSqJUpRhgpLEtyKbKyJKcV_KkhQTZ97R9XzVfVUep4NpC-bruzAcJ_SLgyOiRiWo7xW314tNEcviZyvLm3iOpOLOCQ1LaLJjBoAmWCPDDibWxBRME1eC_2ygW8M_Tb-Xt2Bbw4yQZ0pvI3YpZfHbozj7sBMgs7w6gBbNu9Ax14PXurDr1f1uXNaqVx5C-oIhHfoZskJ8_VxSgvEmYXDD79_ko8CXGa1kB9KZCSObATckpcweMAqrBZIoT8lqcjRnkUXxshb6CIhjh6Yr4ufOmq2Z2UEjmHwM7bzI6QkQFQVU0ozqMkPLjzKMsgbpUI0jJZGGOu33oPcnm9N_nl1Bxw298Wz84D-dwR6vRrBeunIObZSdXqB_ruJLvrM_AsqV7g
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Sealing+structure+for+highly+moisture+sensitive+electronic+device+element+and+method+for+fabrication&rft.inventor=SERBICKI%2C+JEFFREY+PETER&rft.inventor=BOROSON%2C+MICHAEL+LOUIS&rft.inventor=SCHMITTENDORF%2C+JOHN&rft.inventor=BESSEY%2C+PETER+G&rft.date=2006-10-04&rft.externalDBID=A3&rft.externalDocID=EP1296388A3