Sealing structure for highly moisture sensitive electronic device element and method for fabrication

A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclos...

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Bibliographic Details
Main Authors SERBICKI, JEFFREY PETER, BOROSON, MICHAEL LOUIS, SCHMITTENDORF, JOHN, BESSEY, PETER G
Format Patent
LanguageEnglish
French
German
Published 04.10.2006
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
SEPARATION
TRANSPORTING
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Summary:A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
Bibliography:Application Number: EP20020078714