Sealing structure for highly moisture sensitive electronic device element and method for fabrication
A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclos...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English French German |
Published |
04.10.2006
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate (10) and the encapsulation enclosure (30) around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices. |
---|---|
Bibliography: | Application Number: EP20020078714 |