Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps

• Main Authors: BOROSON, MICHAEL L, SERBICKI, JEFFREY PETER, SCHMITTENDORF, JOHN, BESSEY, PETER G
• Format: Patent
• Language: English; French; German
• Published: 26.03.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PHYSICS; SEMICONDUCTOR DEVICES; SEPARATION; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING

A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate (10) and the encapsulation enclosure (30) to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes (100) and vent hole seal material (102) or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.