Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate (10) and the encapsulation e...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
26.03.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A highly moisture-sensitive element (14) and method of making such element includes an encapsulation enclosure (30) encapsulating all of the highly moisture-sensitive electronic devices (12) on a substrate (10) and a sealing material (20) positioned between the substrate (10) and the encapsulation enclosure (30) to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes (100) and vent hole seal material (102) or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material. |
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Bibliography: | Application Number: EP20020078700 |