Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board

A printing mask (1) has protrusions (13) having through holes (12) defined therein for printing a solder paste (3) on lands (6) on a printed circuit board (2). The protrusions (13) serve to increase the amount of solder paste (3) filled in the through holes (12).

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Bibliographic Details
Main Authors TANAKA, AKIHIRO, SAKAI, HIROSHI, SUZUKI, MOTOJI, IGARASHI, MAKOTO
Format Patent
LanguageEnglish
French
German
Published 16.06.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRINTING
PRINTING MACHINES OR PRESSES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A printing mask (1) has protrusions (13) having through holes (12) defined therein for printing a solder paste (3) on lands (6) on a printed circuit board (2). The protrusions (13) serve to increase the amount of solder paste (3) filled in the through holes (12).
Bibliography:Application Number: EP20020011643