Tin plating

Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Saved in:
Bibliographic Details
Main Authors TOBEN, MICHAEL P, EGLI, ANDR, HEBER, JOCHEN, SCHWAGER, FELIX
Format Patent
LanguageEnglish
French
German
Published 18.09.2002
Edition7
Subjects
CHEMISTRY
HUMAN NECESSITIES
HYGIENE
MEDICAL OR VETERINARY SCIENCE
METALLURGY
ORGANIC CHEMISTRY
PEPTIDES
PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.
Bibliography:Application Number: EP20020251833