Method for exposing at least one or at least two semiconductor wafers

• Main Authors: SCHMIDT, SEBASTIAN, OTTO, RALF, SCHEDEL, THORSTEN, FISCHER, THOMAS, HOMMEN, HEIKO
• Format: Patent
• Language: English; French; German
• Published: 28.08.2002
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

Semiconductor wafers (1, 2), e.g. a lot (10), are exposed after an alignment (20) in a wafer stepper or scanner (35) with each determining their alignment parameters. Using, e.g., a linear formula with tool specific coefficients the overlay accuracy can be calculated from these alignment parameters...