METHOD FOR ELECTRICALLY CONDUCTIVE BONDING BETWEEN TWO SEMICONDUCTOR ELEMENTS

A method of creating an electrically conducting bonding between a face of a first semiconductor element and a face of a second semiconductor element using heat treatment. The method applies the faces one against the other with the placing between them of at least one layer of a material configured t...

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Bibliographic Details
Main Authors MADAR, ROLAND, JAUSSAUD, CLAUDE, JALAGUIER, ERIC
Format Patent
LanguageEnglish
French
German
Published 10.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of creating an electrically conducting bonding between a face of a first semiconductor element and a face of a second semiconductor element using heat treatment. The method applies the faces one against the other with the placing between them of at least one layer of a material configured to provide, after heat treatment, an electrically conducting bonding between the two faces. The deposited layers are chosen so that the heat treatment does not induce any reaction product between said material and the semi-conductor elements. Then, a heat treatment is carried out.
Bibliography:Application Number: EP20000960820