Photoresist composition

Disclosed are photoimageable compositions having improved stripping properties including an organic acid. Also disclosed are methods of enhancing the strippability of photoimageable compositions and methods for manufacturing printed wiring boards using such photoimageable compositions.

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Bibliographic Details
Main Author KOES, THOMAS A
Format Patent
LanguageEnglish
French
German
Published 29.05.2002
Edition7
Subjects
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Summary:Disclosed are photoimageable compositions having improved stripping properties including an organic acid. Also disclosed are methods of enhancing the strippability of photoimageable compositions and methods for manufacturing printed wiring boards using such photoimageable compositions.
Bibliography:Application Number: EP20010309900