Method for exposing a semiconductor wafer

A method for exposing a semiconductor wafer is provided, which provides a compensation of the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by adjusting sets of exposure parameters (30), preferably dose and focus, of an exposure tool for any exposure fiel...

Full description

Saved in:
Bibliographic Details
Main Authors SCHEDEL, THORSTEN, SEIDEL, TORSTEN
Format Patent
LanguageEnglish
French
German
Published 15.05.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method for exposing a semiconductor wafer is provided, which provides a compensation of the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by adjusting sets of exposure parameters (30), preferably dose and focus, of an exposure tool for any exposure field (21) individually across a semiconductor wafer (10).
Bibliography:Application Number: EP20000124564