Sidewall process to improve the flash memory cell performance

A method of forming a FLASH memory device having a conductive line (24) which crosses a trench isolation structure (70). The method involves forming nitride sidewalls (125) to protect the stack during the SAS etch process.

Saved in:
Bibliographic Details
Main Authors YUAN, JESSIE, MEHRAD, FREIDOON, AMBROSE, THOMAS M
Format Patent
LanguageEnglish
French
German
Published 27.03.2002
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method of forming a FLASH memory device having a conductive line (24) which crosses a trench isolation structure (70). The method involves forming nitride sidewalls (125) to protect the stack during the SAS etch process.
Bibliography:Application Number: EP20010000490