Sidewall process to improve the flash memory cell performance
A method of forming a FLASH memory device having a conductive line (24) which crosses a trench isolation structure (70). The method involves forming nitride sidewalls (125) to protect the stack during the SAS etch process.
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
27.03.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method of forming a FLASH memory device having a conductive line (24) which crosses a trench isolation structure (70). The method involves forming nitride sidewalls (125) to protect the stack during the SAS etch process. |
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Bibliography: | Application Number: EP20010000490 |