MONITORING SYSTEM FOR DICING SAWS

• Main Authors: LICHT, ODED, YEHOSHUA, WEISSHAUS, ILAN
• Format: Patent
• Language: English; French; German
• Published: 20.03.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; BROACHING; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILING; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PERFORMING OPERATIONS; PHYSICS; PLANING; REGULATING; SAWING; SCRAPING; SEMICONDUCTOR DEVICES; SHEARING; SLOTTING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.