MONITORING SYSTEM FOR DICING SAWS
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
20.03.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate. |
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Bibliography: | Application Number: EP20000992257 |