IMPROVEMENTS RELATING TO HEATING ELEMENTS, PARTICULARLY IN THE FIELD OF THICK FILM HEATIING ELEMENTS

A thick film heating element for a water boiling vessel is secured to the bottom of the vessel with a heat dispersion layer of copper or aluminium between the vessel bottom and the thick film heating element and extending laterally beyond the edges of the thick film heating element. The thick film h...

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Bibliographic Details
Main Authors O'NEILL, ROBERT, ANDREW, MOORE, ROBIN, KEITH
Format Patent
LanguageEnglish
French
German
Published 12.12.2012
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:A thick film heating element for a water boiling vessel is secured to the bottom of the vessel with a heat dispersion layer of copper or aluminium between the vessel bottom and the thick film heating element and extending laterally beyond the edges of the thick film heating element. The thick film heating element is about half the size of a conventional thick film heating element (about 60mm as compared to 110mm) with a corresponding cost reduction, and has at least twice as high a power density (60W/cm2 as compared to 30W/cm2) and yet does not generate excessive noise in operation.
Bibliography:Application Number: EP20000927490