Polymer and ceramic composite electronic substrates

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/ °C at 100°C. The composite substrate may be either ceramic- filled polymeric material...

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Bibliographic Details
Main Authors FAROOQ, SHAJI, KNICKERBOCKER, JOHN ULRICH, HUMENIK, JAMES N, PASCO, ROBERT WILLIAM, HERRON, LESTER WYNN, PERRY, CHARLES H, SACHDEV, KRISHNA G, BERGER, DANIEL GEORGE
Format Patent
LanguageEnglish
French
German
Published 02.01.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/ °C at 100°C. The composite substrate may be either ceramic- filled polymeric material or polymer-filled ceramic material.
Bibliography:Application Number: EP20010305287