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Summary:This invention relates to a method for coating a metallic device with a radioactive isotope. The coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coating, and are therefore suitable for use within biological systems. The method involves coating a metallic device using electroplating a radioisotope. With this method, the coating procedures are followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate. Substrates coated using the methods of this invention exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications, for example as stents, catheters, seeds, protheses, vavles, staples and other wound closure devices, where a localized therapeutic treatment is desired.
Bibliography:Application Number: EP20010110092