ADHESIVE-COATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD BOTH OBTAINED WITH THE SAME

A resin coated copper foil obtained by disposing on one side of a copper foil a layer of an adhesive composition having as essential components (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as required, and (d) a compound having a triazine ring or an isocyanuric ring, has...

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Bibliographic Details
Main Authors KOBAYASHI, KAZUHITO, ARATA, MICHITOSHI, TAKANO, NOZOMU
Format Patent
LanguageEnglish
French
German
Published 17.10.2001
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:A resin coated copper foil obtained by disposing on one side of a copper foil a layer of an adhesive composition having as essential components (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as required, and (d) a compound having a triazine ring or an isocyanuric ring, has low water absorption, high heat resistance and good adhesion to the copper foils, and by using this resin coated copper foil it is possible to obtain a copper-clad laminate and a printed circuit board having excellent properties.
Bibliography:Application Number: EP19990959924