Method of preparing thermally conductive compounds by liquid metal bridged particle clusters

A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120 DEG C and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plast...

Full description

Saved in:
Bibliographic Details
Main Authors MISRA, SANJAY, OLSON, RICHARD M
Format Patent
LanguageEnglish
French
German
Published 10.10.2001
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120 DEG C and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin such as silicone oil to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin.
Bibliography:Application Number: EP20010303105