Copolymers having polyamide blocks and polyether blocks derived from ethoxylated amines

• Main Authors: LINEMANN, REINHARD, HILGERS, HERMANN
• Format: Patent
• Language: English; French; German
• Published: 26.09.2001
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Copolymers with polyamide and ethoxylated primary amine blocks which have fusion temperature 80-135 degrees C and melt fluidity index 5-80 g/10 min (2.16 kg, 150 degrees C) La présente invention concerne des copolymères à blocs polyamides et blocs polyéthers à base d'amines primaires éthoxylées, ces copolymères ayant une température de fusion comprise entre 80°C et 135°C et un MFI (Melt flow index ou indice de fluidité à l'état fondu) compris entre 5 et 80 g/ 10 min (2,16kg - 150°C). Elle concerne aussi des adhésifs du type HMA (ou hot melt adhesives) constitués des copolymères à blocs polyamides et blocs polyéthers précédents.