Tin-indium alloy electroplating solution

A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin sa...

Full description

Saved in:
Bibliographic Details
Main Authors TSUNODA, KYOKO, TAMURA, TAKAAKI
Format Patent
LanguageEnglish
French
German
Published 18.07.2001
Edition7
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, further adding a chelating agent, and adjusting the pH of the aqueous solution to a value of 7 to 11 with a caustic alkali.
Bibliography:Application Number: EP20000309300