FIBER-FREE SHAPED PARTS

A fiber-free molding composition containing: (a) a binder selected from the group consisting of an epoxide, a polyisocyanate, a furane-resin-free phenolic resin, and mixtures thereof; and (b) a filler mixture containing: (i) an inorganic high-temperature-resistant filler; and (ii) a heat-activatable...

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Bibliographic Details
Main Authors LEHR, KLAUS, KAISER, MARIA-ELISABETH, SIX, WOLFGANG, GRAF, ROBERT
Format Patent
LanguageEnglish
French
German
Published 20.12.2000
Edition7
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:A fiber-free molding composition containing: (a) a binder selected from the group consisting of an epoxide, a polyisocyanate, a furane-resin-free phenolic resin, and mixtures thereof; and (b) a filler mixture containing: (i) an inorganic high-temperature-resistant filler; and (ii) a heat-activatable swelling agent.
Bibliography:Application Number: EP19990915527