POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME

A polyamide resin composition which contains 0.5 to 50 wt.% of an apatite type compound and which, when eluted with a phenol solvent and filtered, leaves 1 to 100 parts by weight of residual organic substances per 100 parts by weight of the apatite type compound has high strength and rigidity and is...

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Bibliographic Details
Main Authors WATANABE, KATSUSHI, ARAMAKI, MASAAKI
Format Patent
LanguageEnglish
French
German
Published 04.05.2005
Edition7
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:A polyamide resin composition which contains 0.5 to 50 wt.% of an apatite type compound and which, when eluted with a phenol solvent and filtered, leaves 1 to 100 parts by weight of residual organic substances per 100 parts by weight of the apatite type compound has high strength and rigidity and is excellent in toughness. Moreover, the composition is reduced in water absorption and warpage and is excellent in rigidity upon water absorption, heat resistance, creep resistance, dimensional stability and moldability. Thus, the composition is suitable for use as an industrial material for producing mechanical parts, electrical/electronic parts, etc.
Bibliography:Application Number: EP19990929723