WAFER LEVEL INTEGRATION OF MULTIPLE OPTICAL ELEMENTS

A method of making optical elements on a wafer level comprising: - making a master including an array of optical elements; - embossing a replica of said array of optical elements by applying said master to an embossable material; and - dicing said replica to form individual optical elements.

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Bibliographic Details
Main Authors FELDMAN, MICHAEL R, KATHMAN, ALAN, HARDEN, BRIAN
Format Patent
LanguageEnglish
French
German
Published 20.09.2000
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MATERIALS THEREFOR
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A method of making optical elements on a wafer level comprising: - making a master including an array of optical elements; - embossing a replica of said array of optical elements by applying said master to an embossable material; and - dicing said replica to form individual optical elements.
Bibliography:Application Number: EP19980949707