SEMICONDUCTOR ARRANGEMENT ON A DCB SUBSTRATE

• Main Authors: KLOTZ, FRANK, LORENZ, LEO
• Format: Patent
• Language: English; French; German
• Published: 10.10.2001
• Edition: 7
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRICITY; GENERATION

A power semiconductor array on a direct copper bonding (DCB) semiconductor substrate is created, in which the interference emissions propagated via its terminal lines are eliminated, or at least greatly reduced, directly on the semiconductor device. The power semiconductor array on the DCB substrate includes a first intermediate circuit terminal connected to a positive potential, a second intermediate circuit terminal connected to a negative potential, and at least one load terminal. The power semiconductor array further includes at least two power switches for connecting the load terminal to the first and second intermediate circuit terminals in alternation. The power semiconductor array is characterized by bridging connections that connect at least some of the terminals of the power semiconductor array that lead to the outside to one another in pairs, so that interference circuits within the power semiconductor array are closed.