MOLDED FLEX CIRCUIT BALL GRID ARRAY AND METHOD OF MAKING

A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes or vias in the substrate which define a contact pad array on the op...

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Bibliographic Details
Main Authors DARVEAUX, ROBERT, F, FREYMAN, BRUCE, J
Format Patent
LanguageEnglish
French
German
Published 24.11.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes or vias in the substrate which define a contact pad array on the opposite surface. The substrates are tested and acceptable, then mounted on a carrier strip with longitudinally aligned apertures. The carrier strip is typically a metal such as copper. The strip with mounted substrates is then passed to a station where an IC die is mounted on the substrate first surface, wire bonds are placed from the die to the bonding pads, and the assembly is encapsulated by auto-molding to form a package body. Subsequently, interconnecting bumps are placed on the contact pads and the assembly is removed from the strip.
Bibliography:Application Number: EP19970922331