APPARATUS FOR MANUFACTURING ADHESIVE LAYER, APPARATUS FOR MANUFACTURING DOUBLE-SIDED SUBSTRATE, AND APPARATUS FOR MANUFACTURING MULTI-LAYERED SUBSTRATE

• Main Authors: KATO, KANJI, HAYASHI, HIDENORI, OCHI, AKIO, TANIZAKI, TOSHIO, WADA, AKIRA
• Format: Patent
• Language: English; French; German
• Published: 07.07.1999
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

It is an object to provide an apparatus for manufacturing adhesive layers which can be manufactured in a manufacturing process which is fine, which exhibits an excellent mounting efficiency, which does not require a plating process and which is clean, double-sided substrates and multilayer substrates. A bonding-layer forming portion (5) incorporates a bonding portion (1), a hole machining portion (2), a charging portion (3) and a separating portion (4). A double-sided-substrate forming portion incorporates a bonding portion (6), a hole machining portion (7), a charging portion (8) and a separating portion (9), further incorporating a laminating portion (10), a resin hardening portion (11) and a pattern forming portion (12). The apparatus for manufacturing the multilayer substrate has a multilayer laminating portion (13), a resin hardening portion, a resin hardening portion (14) and an outer-layer-patter forming portion (15) to follow the bonding-layer forming portion (5) and the double-sided-substrate forming portion (16).